Lux Semiconductors' System-on-Foil technology is designed to reduce the size and improve the performance of microelectronics for spacecraft, aircraft and other applications. Credit: Lux Semiconductors ...

Microelectronics has been a hot topic in technology circles in recent years. Although the CHIPS and Science Act is a main driver of the latest resurgence, the defense industrial base’s reliance on ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

ANDOVER, Mass., April 21, 2022 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical technologies for aerospace and defense, hosted a ...

In pursuit of more powerful microelectronic systems, more powerful microchips must be packaged closer together, with more robust connections – the same is true for the research partnership to achieve ...

DURHAM, N.C.--(BUSINESS WIRE)--Semiconductor Research Corporation (SRC), a world-renowned semiconductor research and workforce development consortium, released an interim report for the ...

A new technical paper titled “A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations” was ...

SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), announced today that the International ...

The U.S. Department of Defense (DoD) celebrated a milestone achievement for the State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) Program with the delivery of the first SHIP prototype ...

A technical paper titled “US Microelectronics Packaging Ecosystem: Challenges and Opportunities” was published by researchers at University of Florida, University of Miami, and Skywater Technology ...